US Patent Issued to Resonac on Nov. 25 for "Thermally conductive resin composition, cured product, heat transfer member and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,031, issued on Nov. 25, was assigned to Resonac Corp. (Tokyo).

"Thermally conductive resin composition, cured product, heat transfer member and electronic device" was invented by Hajime Yukutake (Minato-ku, Japan), Hajime Funahashi (Minato-ku, Japan) and Hikaru Satoh (Minato-ku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive resin composition includes an epoxy resin and a thermally conductive powder. The thermally conductive powder includes aluminum nitride having a silicon-containing oxide coating on a surface thereof and another thermally conductive powder. The content of the epoxy resin is 1% by mass or more and 20% b...