ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,760, issued on May 27, was assigned to RESONAC Corp. (Tokyo).
"Method for manufacturing electronic component device" was invented by Tomoaki Shibata (Tokyo), Tsuyoshi Ogawa (Tokyo) and Xinrong Li (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method for manufacturing an electronic component including: forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material; curing the sealing resin layer; filling the via hole with a conductor precursor; and forming a conductive...