US Patent Issued to Resonac on March 25 for "Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,468, issued on March 25, was assigned to Resonac Corp. (Tokyo).

"Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package" was invented by Yuya Hirayama (Tokyo), Keisuke Kushida (Tokyo), Kenichi Tomioka (Tokyo) and Hiroshi Shimizu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepr...