US Patent Issued to RESONAC on March 18 for "Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,490, issued on March 18, was assigned to RESONAC Corp. (Tokyo).

"Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package" was invented by Mari Shimizu (Tokyo), Daisuke Fujimoto (Tokyo), Yasuo Kamigata (Tokyo), Tomohiko Kotake (Tokyo), Shin Takanezawa (Tokyo), Akira Shimizu (Tokyo), Harumi Negishi (Tokyo), Kouichi Aoyagi (Tokyo) and Sayaka Kikuchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without usi...