US Patent Issued to Resonac on March 18 for "Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin composition" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,600, issued on March 18, was assigned to Resonac Corp. (Tokyo).

"Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin composition" was invented by Hajime Yukutake (Yokohama, Japan), Yuki Otsuka (Yokohama, Japan), Naoki Minorikawa (Yokohama, Japan), Hidetoshi Okamoto (Yokohama, Japan) and Toshihiro Arai (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inorganic particle dispersion resin composition, containing: a resin; and inorganic particles, in which the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and the silica-covered al...