US Patent Issued to RESONAC on March 11 for "Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump" (Japanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,246,398, issued on March 11, was assigned to RESONAC Corp. (Tokyo).

"Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump" was invented by Kunihiko Akai (Tokyo), Masayuki Miyaji (Tokyo), Junichi Kakehata (Tokyo) and Yoshinori Ejiri (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 micro metre and a C.V. value of 20% or less, and a part of the solder p...