US Patent Issued to RESONAC on June 3 for "Polyamideimide resin, resin composition, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,814, issued on June 3, was assigned to RESONAC Corp. (Tokyo).

"Polyamideimide resin, resin composition, and semiconductor device" was invented by Gaku Hashimoto (Tokyo), Daichi Takemori (Tokyo), Eiichi Satoh (Tokyo) and Mizuki Sato (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polyamideimide resin containing a structural unit (Ia) represented by a formula shown below, and a structural unit (IIa) represented by a formula shown below. In the formula (Ia), each X independently represents a hydrogen atom, or at least one substituent selected from the group consisting of halogen atoms, alkyl groups of 1 to 9 carbon, atoms, and alkoxy groups and ...