US Patent Issued to Resonac on July 22 for "Polishing liquid, polishing liquid set, polishing method, and defect suppression method" (Japanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,815, issued on July 22, was assigned to Resonac Corp. (Tokyo).

"Polishing liquid, polishing liquid set, polishing method, and defect suppression method" was invented by Hisato Takahashi (Tokyo), Masayuki Hanano (Tokyo) and Toshio Takizawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing liquid includes abrasive grains containing at least one selected from the group consisting of cerium oxide and silicon oxide; a nitrogen-containing compound; and water. The nitrogen-containing compound contains nicotinamide. A polishing liquid set includes constituent components of a polishing liquid stored while being divided into a first liquid and...