ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,783, issued on July 22, was assigned to Resonac Corp. (Tokyo).
"Compound, molded article, and cured product" was invented by Hidetoshi Inoue (Tokyo), Yuta Ono (Tokyo) and Yoshinori Endo (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A compound includes metal powder, an epoxy resin, and a wax. The content of the metal powder is from 96 mass % to less than 100 mass %. The wax includes at least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters."
The patent was filed on May 20, 2020, under Application No. 17/613,493.
*For further information, including images, ...