US Patent Issued to RESONAC on July 15 for "Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,826, issued on July 15, was assigned to RESONAC Corp. (Tokyo).

"Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate" was invented by Yoshikatsu Shiraokawa (Tokyo), Shinichi Kamoshida (Tokyo) and Hiroshi Kurokawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 Mug...