US Patent Issued to Resonac on Jan. 13 for "Slurry, polishing method, and method for producing semiconductor component" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,748, issued on Jan. 13, was assigned to Resonac Corp. (Tokyo).

"Slurry, polishing method, and method for producing semiconductor component" was invented by Satoshi Furukawa (Tokyo), Tomohiro Iwano (Tokyo), Shigeki Kubota (Tokyo), Atsuko Ueda (Tokyo) and Koichi Kagesawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slurry containing: abrasive grains; a compound X having 3 or more carbon atoms; and water, in which the abrasive grains contain cerium oxide, and a dispersion term dD in Hansen solubility parameters of the compound X is 18.0 MPa1/2 or less. A polishing method including polishing a surface to be polished by using this slurry."

Th...