US Patent Issued to Resonac on Feb. 10 for "Welding film and joined body" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,822, issued on Feb. 10, was assigned to Resonac Corp. (Tokyo).

"Welding film and joined body" was invented by Ryota Niibayashi (Tokyo), Nobuyuki Takahashi (Tokyo), Hayato Saito (Tokyo) and Kunihiro Kuroki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin is 5.0 or more."

The patent was filed on Feb. 4, 2022, under Application No. 18/276,510.

*For further information, including images, charts and tables, please ...