ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,832, issued on Feb. 10, was assigned to Resonac Corp. (Tokyo).
"Copper paste, wick formation method, and heat pipe" was invented by Hideo Nakako (Tokyo), Toshiaki Tanaka (Tokyo), Dai Ishikawa (Tokyo), Yoshinori Ejiri (Tokyo) and Michiko Natori (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A copper paste for forming a wick of a heat pipe contains copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium. A method for forming a wick of a heat pipe comprises a step of...