US Patent Issued to Resonac on Aug. 5 for "Polishing solution, dispersion, polishing solution production method, and polishing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,438, issued on Aug. 5, was assigned to Resonac Corp. (Tokyo).

"Polishing solution, dispersion, polishing solution production method, and polishing method" was invented by Keisuke Inoue (Tokyo) and Hiroshi Ono (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing liquid for CMP, containing: abrasive grains containing silica; and a liquid medium, in which a content of the abrasive grains is 1.0% by mass or more based on the total amount of the polishing liquid, and in a particle size distribution on mass basis obtained by a centrifugation method, D50 of the abrasive grains is 150 nm or less, D90 of the abrasive grains is 100 nm or more, and...