US Patent Issued to RESONAC on April 8 for "Liquid resin composition for sealing and electronic component device" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,943, issued on April 8, was assigned to RESONAC Corp. (Tokyo).

"Liquid resin composition for sealing and electronic component device" was invented by Yuma Takeuchi (Tokyo), Hisato Takahashi (Tokyo) and Hiroyoshi Deguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more."

The patent was filed on May 11, 2016, under Application No. 16/300,101.

*For further information, includi...