US Patent Issued to Resonac on April 29 for "Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,767, issued on April 29, was assigned to Resonac Corp. (Tokyo).

"Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film" was invented by Shohei Yamazaki (Tokyo), Hiroyuki Izawa (Tokyo) and Toshiyuki Sugimoto (Yamagata, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for classifying solder particles includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 included in an electrostatic attraction device, the first electrode 2 having a disposition part having electrostatic diffusivity or electrical conductivity, the seco...