US Patent Issued to Resonac, NAMICS on Oct. 28 for "Liquid resin composition for compression molding and electronic component apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,612, issued on Oct. 28, was assigned to Resonac Corp. (Tokyo) and NAMICS Corp. (Niigata, Japan).

"Liquid resin composition for compression molding and electronic component apparatus" was invented by Hidetoshi Inoue (Tokyo), Takayuki Matsuzaki (Tokyo), Hisato Takahashi (Tokyo), Tsuyoshi Kamimura (Niigata, Japan) and Haruyuki Yoshii (Niigata, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D)."

The patent was filed on May...