ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,470, issued on June 24, was assigned to Reophotonics Ltd. (Modiin, Israel).
"Methods to fill through-holes of a substrate with metal paste" was invented by Michael Zenou (Hashmonaim, Israel).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a method for filling through-holes of a substrate with a metal paste, an upper lamination foil is secured to the top surface of the substrate and a lower lamination foil is secured to the bottom surface of the substrate. A laser beam is used to generate a first plurality of holes in the upper lamination foil, and a second plurality of holes in the lower lamination foil. Respective locations of the first and second...