US Patent Issued to Rensselaer Polytechnic Institute on Jan. 13 for "3D printed integrated thermal management and light transfer structures" (New York Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,367, issued on Jan. 13, was assigned to Rensselaer Polytechnic Institute (Troy, N.Y.).

"3D printed integrated thermal management and light transfer structures" was invented by Nadarajah Narendran (Clifton Park, N.Y.), Jean Paul Freyssinier (Troy, N.Y.) and Ukwatte Lokuliyanage Indika Perera (Clifton Park, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "One embodiment provides a luminaire. The luminaire includes a light transfer structure, and a thermal management structure. The light transfer structure is configured to receive light from at least one light emitting diode (LED). The thermal management structure is configured to manage a thermal e...