US Patent Issued to RENESAS ELECTRONICS on Sept. 30 for "Manufacturing method of semiconductor device and test socket for use in the same" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,497, issued on Sept. 30, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).

"Manufacturing method of semiconductor device and test socket for use in the same" was invented by Toshitsugu Ishii (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor device includes a step of preparing a test object including a body for sealing a semiconductor chip and a lead terminal, a step of preparing a test socket including a first contact pin, and a step of electrically testing the semiconductor chip by contacting the first contact pin with the lead terminal. The lead terminal includes a lead upper surface located on an up...