ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,835, issued on Nov. 11, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).
"Semiconductor device" was invented by Yoshihiro Masumura (Tokyo), Takamichi Hosokawa (Tokyo) and Keita Takada (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first chip mounting portion; a second chip mounting portion; a first semiconductor chip mounted on the first chip mounting portion; second and third semiconductor chips mounted on the second chip mounting portion; and a sealing body for sealing them. Here, the third semiconductor chip includes a first coil and a second coil that are magnetically coupled to each other. Also, the f...