US Patent Issued to RENESAS ELECTRONICS on Jan. 13 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,517, issued on Jan. 13, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).

"Semiconductor device and method of manufacturing the same" was invented by Hiroaki Sekikawa (Tokyo), Yasutaka Nakashiba (Tokyo), Hideki Sasaki (Tokyo) and Hajime Hayashimoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Reliability of a semiconductor device is improved. The semiconductor device includes a clip which is electrically connected to a main-transistor source pad via a first silver paste and is connected to a lead via a second silver paste. The clip has a "first part" with which the first silver paste is in contact, a "second part" with which the second sil...