US Patent Issued to RENESAS ELECTRONICS on Aug. 5 for "Semiconductor chip, semiconductor device and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,727, issued on Aug. 5, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).

"Semiconductor chip, semiconductor device and manufacturing method of semiconductor device" was invented by Yoshito Tanaka (Tokyo) and Hideaki Hashimoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip includes a first electrode connected to a gate of a power device, a second electrode connected to an emitter or a source of the power device, a third electrode, and a gate protection element. The gate protection element includes a first node and a second node, and a plurality of stages of p-n junctions formed between the first node and the second node. W...