ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,914, issued on April 22, was assigned to REC SOLAR PTE. LTD. (Singapore).
"Cost effective frame design for thinner wafers" was invented by Noel G. Diesta (Singapore) and Shankar Gauri Sridhara (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "A slim solar module is proposed. It comprises a solar laminate comprising plural solar cells interposed between front and rear cover sheets, a frame enclosing the solar laminate and at least one reinforcement strut arranged at a rear surface of the solar laminate. A ratio between a frame surface and a frame thickness shall be between 45000 and 70000. For example, the frame may have a thickness of less th...