ALEXANDRIA, Va., June 17 -- United States Patent no. 12,314,070, issued on May 27, was assigned to REALTEK SEMICONDUCTOR Corp. (Hsinchu, Taiwan).

"Circuit layout for improving power supply rejection ratio" was invented by Kuan-Yu Shih (Hsinchu, Taiwan) and Ying-Rong Su (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit layout for improving the power supply rejection ratio includes a radio frequency (RF) choke and an inductor. The RF choke receives a supply voltage and includes: a first choke coil positioned in an ultra-thick metal (UTM) layer, the coil including a first choke electrode; and a second choke coil positioned in a redistribution layer (RDL), the coil including a second chok...