US Patent Issued to Realtek Semiconductor on Jan. 27 for "Method and apparatus for simulating breakdown of electronic component" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,375, issued on Jan. 27, was assigned to Realtek Semiconductor Corp. (HsinChu, Taiwan).

"Method and apparatus for simulating breakdown of electronic component" was invented by Shih-Hsin Liao (HsinChu, Taiwan), Rui-Hong Liu (HsinChu, Taiwan), Tay-Her Tsaur (HsinChu, Taiwan) and Po-Ching Lin (HsinChu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus for simulating breakdown of an electronic component are provided. The method includes: when a terminal of an equivalent circuit model receives test charges, pulling up a voltage level of a first node of the equivalent circuit model; when the voltage level of the first node reache...