US Patent Issued to REALTEK SEMICONDUCTOR on Dec. 30 for "Electronic package structure and chip thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,436, issued on Dec. 30, was assigned to REALTEK SEMICONDUCTOR CORP. (Hsinchu, Taiwan).

"Electronic package structure and chip thereof" was invented by Chia-Lin Chang (Hsinchu, Taiwan), Yun-Tse Chen (Hsinchu, Taiwan), Kai-Yin Liu (Hsinchu, Taiwan) and Cheng-Cheng Yen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package structure and a chip thereof are provided. The electronic package structure includes a supporting element, a chip, an internal bonding wire, and a plurality of external bonding wires. The supporting element has a chip arrangement portion. The chip has a first surface and a second surface opposite to the...