ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,159, issued on April 15, was assigned to RAYTHEON TECHNOLOGIES Corp. (Waltham, Mass.).
"Wire bonded air heat sink" was invented by James S. Wilson (Hurst, Texas), Alyson M. Tuttle (Plano, Texas) and Karl L. Worthen (Dallas).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electric...