US Patent Issued to Raytheon on Sept. 23 for "Integrated diamond substrate for thermal management" (Massachusetts, New Hampshire Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,594, issued on Sept. 23, was assigned to Raytheon Co. (Arlington, Va.).

"Integrated diamond substrate for thermal management" was invented by Jarrod Vaillancourt (South Hampton, N.H.) and Matthew C. Tyhach (Wakefield, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is an apparatus and a method for thermal management. The apparatus includes an integrated circuit (IC) including at least one field effect transistor, wherein each at least one FET comprises a gate, a drain, and a source; and a diamond substrate bonded to the gate, the drain, and the source of each of the at least one FETs, wherein the diamond substrate includes at ...