US Patent Issued to Raytheon on Sept. 2 for "Wafer-scale direct bonded array core block for an active electronically steerable array (AESA)" (Arizona, Massachusetts Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,901, issued on Sept. 2, was assigned to Raytheon Co. (Arlington, Va.).

"Wafer-scale direct bonded array core block for an active electronically steerable array (AESA)" was invented by Miroslav Micovic (Marana, Ariz.), Karen Kaneko Baker (Tucson, Ariz.), Christopher Carbonneau (Marana, Ariz.), Katherine J. Herrick (Tucson, Ariz.), Teresa J. Clement (Tucson, Ariz.) and Jeffrey R. Laroche (Andover, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An Array Core Block for an AESA includes a stack of 2*M alternating N-channel RFIC and MMIC Power Amplifier wafers bonded together by a wafer-scale direct bond hybrid (DBH) interconnect process. This proce...