ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,310, issued on May 20, was assigned to Raytheon Co. (Waltham, Mass.).
"Indium electroplating on physical vapor deposition tantalum" was invented by Michael J. Rondon (Santa Rosa, Calif.), Jon Sigurdson (Santa Barbara, Calif.) and Eric R. Miller (Orcutt, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer stack can be produced by using indium electroplating on physical vapor deposition tantalum. The wafer stack includes a substrate, a tantalum-nitride film formed on the substrate, a tantalum layer formed on the tantalum-nitride film, and indium deposited on the tantalum layer. Various relationships of thicknesses between the tantalum layer ...