US Patent Issued to Raytheon on July 1 for "Integrated circuit having vertical routing to bond pads" (California Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,475, issued on July 1, was assigned to Raytheon Co. (Arlington, Va.).

"Integrated circuit having vertical routing to bond pads" was invented by Eric Miller (Lompoc, Calif.), Christian M. Boemler (Lompoc, Calif.), Justin Gordon Adams Wehner (Goleta, Calif.), Drew Fairbanks (Santa Barbara, Calif.) and Sean P. Kilcoyne (Lompoc, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for an assembly having directly bonded first and second wafers where the assembly includes a backside surface and a front side surface. The first wafer includes IO signal connections vertically routed to the direct bonding interface by a first one of the ...