ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,704, issued on Aug. 26, was assigned to Raytheon Co. (Arlington, Va.) and ThermAvant Technologies LLC (Columbia, Mo.).
"Thermally-enhanced and deployable structures" was invented by Tuan L. Duong (Santa Barbara, Calif.), Adam D. Leeds (Santa Barbara, Calif.), James E. Benedict (Tewksbury, Mass.), Joseph A Boswell (San Francisco) and Daniel A. Pounds (Columbia, Mo.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected t...