ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,137, issued on Jan. 13, was assigned to Raysolve Optoelectronics (Suzhou) Co. Ltd. (Suzhou, China).
"Light emitting diode structure and method for manufacturing the same" was invented by Wing Cheung Chong (Hong Kong).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a light emitting diode (LED) structure is provided. A driving circuit having a plurality of contact pads is formed in a first substrate. A plurality of metal contacts is formed on the first substrate, each metal contact being located on one of the plurality of contact pads. A nonconductive adhesive layer is formed on the first substrate covering the plurality of co...