US Patent Issued to Raynergy Tek Incorporation on Sept. 30 for "Electrode connection structure and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,144, issued on Sept. 30, was assigned to Raynergy Tek Incorporation (Hsinchu, Taiwan).

"Electrode connection structure and method of forming the same" was invented by Yi-Ming Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrode connection structure is provided and includes a substrate, a first electrode, a second electrode, a semiconductor layer, a third electrode, and a conductive block. The first electrode and the second electrode are located on the substrate. The semiconductor layer is located on the first electrode and the second electrode. The third electrode is on the semiconductor layer. The conductive block pen...