ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,255, issued on Feb. 25, was assigned to Rambus Inc. (San Jose, Calif.).
"Vertical interconnects with variable pitch for scalable escape routing" was invented by Mark D. Kellam (Siler City, N.C.) and John Eric Linstadt (Palo Alto, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The embodiments are directed to technologies for variable pitch vertical interconnect design for scalable escape routing in semiconductor devices. One semiconductor device includes a circuit die, and an array of circuit die interconnects located on the circuit die. The array includes a first triangular octant of interconnects that are organized in rows and columns, each ...