ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,471, issued on Aug. 19, was assigned to Rambus Inc. (San Jose, Calif.).
"Memory system topologies including a memory die stack" was invented by Ian Shaeffer (Los Gatos, Calif.), Ely Tsern (Los Altos, Calif.) and Craig Hampel (Los Altos, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrate...