ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,974, issued on May 20, was assigned to Rakuten Symphony Inc. (Tokyo).
"Thermal management in an electronic device chassis" was invented by Gerard MacManus (Surrey, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chassis is provided for supporting electronic device circuitry. The chassis generally includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The cooling surface has a plurality of heatsink fins extending from the cooling surface. The chassis also has at least one vapor chamber between the mounting surface and the cooling surface. The vapor...