ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,134, issued on Aug. 19, was assigned to Rakuten Symphony Inc. (Tokyo).
"Heatsink chassis with aerofoil" was invented by Gerard MacManus (Surrey, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organized into at least two fin sections, wherein a first fin section has a first set of fins of the plurality of fins and a second fin section has a second set of fins of the plurality of fins. The chassis further provide...