US Patent Issued to Raghunandan Chaware on Feb. 3 for "Board-to-board (B2B) connector for improved performance and strength and method of making same" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,394, issued on Feb. 3, was assigned to Raghunandan Chaware (Sunnyvale, Calif.).

"Board-to-board (B2B) connector for improved performance and strength and method of making same" was invented by Raghunandan Chaware (Sunnyvale, Calif.) and Tarangini Deshpande (Menlo Park, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to embodiments, a board-to-board (B2B) connector component includes an array of contacts and a housing holding the array of contacts. At least a portion of the housing is made of glass."

The patent was filed on April 22, 2022, under Application No. 17/727,102.

*For further information, including images, charts and tables...