US Patent Issued to Radpion on Sept. 30 for "Material surface reforming apparatus using ion implantation" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,331, issued on Sept. 30, was assigned to Radpion Inc. (Daejeon, South Korea).

"Material surface reforming apparatus using ion implantation" was invented by Myung Jin Kim (Daejeon, South Korea), Jae Keun Kil (Gumi-si, South Korea) and Bom Sok Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A material surface reforming apparatus using ion implantation includes: a vacuum chamber unit that has an internal space in which vacuum is selectively maintained, and has a station for placing a material that is a surface reforming target in the internal space; a first ion implanter that is mounted at the upper portion of the vacuum chamber...