US Patent Issued to R.P. Scherer Technologies on June 10 for "Apparatus and process for secondary encapsulation of solid inclusions using the rotary die process" (Florida Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,324,857, issued on June 10, was assigned to R.P. Scherer Technologies LLC (Carson City, Nev.).

"Apparatus and process for secondary encapsulation of solid inclusions using the rotary die process" was invented by David Fulper (Clearwater, Fla.) and Knight Arthur McGowan (Tampa, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are a manufacturing process for encapsulating at least one solid inclusion into a softgel capsule. Also disclosed herein is a system for secondary encapsulation of solid inclusions using the rotary die process and system. Also disclosed herein are dosage forms having at least one solid inclusion encapsulated ther...