US Patent Issued to Quantum Silicon on Dec. 30 for "Method for autonomously applying a dangling bond pattern to a substrate" (Canadian Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,511,728, issued on Dec. 30, was assigned to Quantum Silicon Inc. (Edmonton, Canada).

"Method for autonomously applying a dangling bond pattern to a substrate" was invented by Mohammad Rashidi (Edmonton, Canada), Jeremiah Croshaw (Edmonton, Canada) and Robert Wolkow (Edmonton, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for autonomously applying a dangling bond pattern to a substrate for atom scale device fabrication includes inputting the pattern, initiating a patterning process, scanning the substrate using a scanning probe microscope (SPM) to generate an SPM image of the substrate, feeding the SPM image into a trained convolution ne...