US Patent Issued to QUALCOMM on Sept. 9 for "Frame structures for uplink carrier aggregation of two time division duplex carriers" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,413,352, issued on Sept. 9, was assigned to QUALCOMM Inc. (San Diego).

"Frame structures for uplink carrier aggregation of two time division duplex carriers" was invented by Bo Chen (Beijing), Wei Guan (Beijing) and Mingkai Nan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may receive a configuration for time division multiplexed uplink carrier aggregation of a first time division duplex carrier with a second time division duplex carrier, wherein a bandwidth of the second time division duplex carrier is lower than a bandwidt...