US Patent Issued to QUALCOMM on Sept. 9 for "Association of multiple subscriber identity modules" (American, Indian Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,413,955, issued on Sept. 9, was assigned to QUALCOMM Inc. (San Diego).

"Association of multiple subscriber identity modules" was invented by Neel Tej Adusumilli (San Diego), Mayank Arora (Hyderabad, India) and Ozcan Ozturk (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may perform a radio resource control (RRC) setup procedure for a first subscriber identity module (SIM) of the UE and transmit a serving temporary mobile subscriber identity of the first SIM in association with an RRC setup procedure for a second SIM. Nu...