US Patent Issued to QUALCOMM on Sept. 30 for "Mechanism to improve the reliability of sideband in chiplets" (Indian, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,280, issued on Sept. 30, was assigned to QUALCOMM Inc. (San Diego).

"Mechanism to improve the reliability of sideband in chiplets" was invented by Ravindranath Doddi (Hyderabad, India), Umamaheshwaran V (Salem, India), Afreen Haider (Muzaffarpur, India), Lekhya Pavani Godavarthi (Hyderabad, India), Harinatha Reddy Ramireddy (Hyderabad, India), James Lionel Panian (San Marcos, Calif.), Ramacharan Sundararaman (San Jose, Calif.) and Santhosh Reddy Akavaram (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments include methods and devices for implementing Universal Chiplet Interconnect Express (UCIe) link configuration fo...