US Patent Issued to QUALCOMM on Sept. 23 for "Package with a substrate comprising embedded escape interconnects and surface escape interconnects" (California Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,559, issued on Sept. 23, was assigned to QUALCOMM Inc. (San Diego).

"Package with a substrate comprising embedded escape interconnects and surface escape interconnects" was invented by Kuiwon Kang (San Diego), Hong Bok We (San Diego) and Michelle Yejin Kim (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package that includes a substrate, a first integrated device coupled to the substrate, and a second integrated device coupled to the substrate. The substrate includes at least one dielectric layer, and a plurality of interconnects comprising a plurality of escape interconnects. The plurality of escape interconnects includes a first embed...