US Patent Issued to QUALCOMM on Sept. 16 for "Devices including one or more high-impedance layers between a display stack and an ultrasonic fingerprint sensor stack" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,996, issued on Sept. 16, was assigned to QUALCOMM Inc. (San Diego).

"Devices including one or more high-impedance layers between a display stack and an ultrasonic fingerprint sensor stack" was invented by Jessica Liu Strohmann (Cupertino, Calif.), Shiang-Chi Lin (Taoyuan, Taiwan), Shaojui Li (Hsinchu, Taiwan), Hsiang-Chi Liu (Taoyuan, Taiwan), Chia-Wei Yang (Hsinchu, Taiwan), Jae Hyeong Seo (Pleasanton, Calif.) and Kostadin Dimitrov Djordjev (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus may include a display stack, an ultrasonic sensor stack and a high-impedance stack including one or more high-impedance layers. The...