US Patent Issued to QUALCOMM on Oct. 7 for "Enhanced uplink emission capability for subband full duplex" (California Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,585, issued on Oct. 7, was assigned to QUALCOMM Inc. (San Diego).

"Enhanced uplink emission capability for subband full duplex" was invented by Muhammad Sayed Khairy Abdelghaffar (San Jose, Calif.), Abdelrahman Mohamed Ahmed Mohamed Ibrahim (San Diego), Ahmed Attia Abotabl (San Diego) and Krishna Kiran Mukkavilli (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Certain aspects of the present disclosure provide a method for wireless communications by a user equipment (UE) generally including transmitting, to a network entity, capability information indicating a capability of the UE for uplink subband filtering, receiving signaling scheduling ...