ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,822, issued on Nov. 4, was assigned to QUALCOMM Inc. (San Diego).
"Mechanism to enhance link bandwidth in interconnects" was invented by Prakhar Srivastava (Lucknow, India), Santhosh Reddy Akavaram (Hyderabad, India), Chintalapati Bharath Sai Varma (Hyderabad, India), Ravi Kumar Sepuri (Hyderabad, India) and Khushboo Kumari (Noida, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device, implemented using chiplets mounted on a substrate, may include a controller and a first plurality of link modules. The first plurality of link modules may be configured to provide data lanes in a multimodule data communication link. The...